Cooling structure for electronics and machines

ABSTRACT

The invention relates to an improved cooling structure for electronics and machines, which produce heat during working and have been provided with cooling fins or grid. A nanocarbon layer is covered on IC boards, CPUs, and the cooling fins or grids, that facilitates the cooling effect obviously because of increased surface area. Hence, the working electronics and machines can be cooled more conveniently and effectively and input energy will be also saved.

This application claims priority based both on ROC Taiwan application number 095214984 filed on Aug. 24, 2006 and number 096203069 filed on Feb. 15, 2007.

BACKGROUND OF THE INVENTION

In most working electronics and machines, there are usually found that a radiator or a cooling apparatus must be provided to remove the heat produced by them and to keep the electronics and machines working normally without damage. The working electronics and machines could be an air-conditioner, a car, a computer, a LED, a CPU, or any electric equipment. The known cooling structure is to provide a lot of cooling fins or grid thereon. As shown in FIG. 1, for example, it is a traditional air-conditioner, which includes many cooling fins (1) to exhaust heat outward and then the cooling air can be blown indoor. The theory is to use the cooling fins to transfer heat to outward air efficiently. If we want to increase the cooling effect, it is necessary to increase the number of the fins or to change the shape of the fins for increasing the total surface area. But in the space of the working machine, it is still limited. The efficiency of the working machines is poor and energy lost will be high. In FIGS. 4 and 5, a LED assembly are shown, wherein the LED (3) mounted on an IC board (5) is combined within a radiator (4) having many fins (1) thereon. The cooling effect is still poor.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide an improved cooling structure of working electronics and machines, which includes cooling fins covered with a layer of nanocarbon that promotes the cooling effect rapidly. Now, accompanying with the following drawings, the character of the present invention will be described here and after.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a portion of an air-conditioner with traditional cooling fins.

FIG. 2 is a perspective view showing an air-conditioner with the improved cooling structure according to the present invention.

FIG. 3 is a cross-sectional plan view showing the improved cooling structure according to the present invention.

FIG. 4 is a perspective view showing a conventional LED assembly.

FIG. 5 is a cross-sectional plan of FIG. 4.

FIG. 6 is a perspective view showing a LED assembly covered with the cooling structure according to the present invention.

FIG. 7 is a cross-sectional plan of FIG. 6.

FIG. 8 is a perspective view showing a brief conventional CPU assembly.

FIG. 9 is an embodiment of FIG. 8 after connected with the cooling structure of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIGS. 2 and 3, the present invention relates to an improved cooling structure for being uses in a working machine, such as an air-conditioner illustrated in this description, which includes a lot of cooling fins (1) thereon. The character of the present invention mainly is to provide a nanocarbon layer (2), which is composed of many nanocarbon particles (21). The nanocarbon particles (21) are covered on the cooling fins (2) by suitable flux and adherence, wherein tiny gaps are existed between the particles (21).

In the nanocarbon layer (2), some nanocarbon particles (21) contact the fins (1) directly. The upper surface of the layer (2) will be terrific rough that obviously increases large surface area, in which a gram of nanocarbon can be extended to have a bet surface area about 1000 to 2000 square meters as usual. Further, it is known that the nanocarbon has a well character of heat transferring and diffusing. Hence, the cooling fins (1) covered by nanocarbon layer (2) can exhaust heat outward more efficiently. In an experiment, it increases 30% in cooling effect. It will be understood that more nanocarbon particles used will promote the cooling effect accordingly.

Above all, the present invention can increase effective cooling purpose without adding the number of fins or changing the shape of them. It obtains utilization in saving huge energy. Under the same invented merit, it can be also applied in any other working machines, such as a radiator of electric equipment, cooling fins of cars or computes, to obtain a best cooling effect. For example, FIGS. 6 and 7 are the embodiment of the LED assembly in FIGS. 4 and 5, wherein the nanocarbon layer (2) is provided to cover the IC board (5), the radiator (4), and all fins (1). In FIGS. 8 and 9, it is another embodiment of the present invention, wherein a CPU (6) with connected radiator and fins (61) in a computer or any electrical equipment is capable of being covered by the nanocarbon layer (2) for increasing its cooling effect to keep all working electrical components in a normal situation without damage from high temperature.

Moreover, the nanocarbon particles used in the present invention are only exemplary and is not to limit the scope of this application. Other material having a similar character of heat transferring and diffusing can be applied to reach the primary object of the present invention and will be also claimed in this application. 

1. An improved cooling structure for electronics and machines provided with cooling fins or grid thereon, and the character is to provide a nanocarbon layer on the cooling fins or grid, in which the nanocarbon layer is composed of a lot of nanocarbon particles.
 2. The improved cooling structure for electronics and machines as claimed in claim 1, wherein the nanocarbon particles are covered on the cooling fins or grid with tiny gaps by flux and adherence.
 3. The improved cooling structure for electronics and machines as claimed in claim 1, wherein the nanocarbon layer is covered on an IC board, a radiator, and fins of a LED assembly.
 4. The improved cooling structure for electronics and machines as claimed in claim 1, wherein the nanocarbon layer is covered on a CPU, its connected radiator, and fins of a computer. 